Sycamore MEMS Loudspeakers with µCooling Air Pump-on-a-Chip Enable Thinner, Lighter Headphones with Active Humidity Reduction – and Will Debut at xMEMS Live 2025.

xMEMS Labs, the leader in solid-state MEMS speakers and micro-scale thermal management, will unveil a next-generation headphone architecture at the company’s annual xMEMS Live 2025 seminar series on September 16 in Taipei and September 18 in Shenzhen. This new architecture pairs Sycamore, the world’s first MEMS loudspeaker for headphones, with µCooling, the first air pump-on-a-chip, to deliver pristine audio and reduced moisture build-up in a lighter, thinner, and more comfortable headphone experience.

Replacing conventional 40-50mm dynamic coil drivers, the Sycamore MEMS loudspeaker introduces a solid-state alternative that is 98% smaller by volume (just 85mm³ vs. ~4,000mm³ for 50mm drivers) and weighs only 150 milligrams. Despite its micro-scale size, Sycamore delivers full-range, high-fidelity audio performance while requiring only a 1cc back volume, freeing up space inside the earcup for larger batteries, advanced PCBs, and thinner industrial designs.

A single Sycamore-based speaker plate weighs just 18 grams, a dramatic reduction compared to ~42 grams for a conventional 50mm driver assembly. This 57% weight reduction enables headphone designs that are dramatically lighter, reducing fatigue and improving comfort for all-day wear.

In parallel, xMEMS is applying its µCooling technology to headphones delivering the world’s first silent, vibration-free, sensation-free active humidity control inside the earcup. By actively reducing moisture and maintaining optimal humidity, µCooling addresses a longstanding challenge in over-ear headphone design: heat and moisture buildup during extended listening sessions. The result is a cooler, dryer, and more enjoyable long-term wearing experience. Early testing demonstrates that µCooling can effectively regulate ambient humidity levels inside the earcup during extended use. In test cases where humidity was allowed to build up prior to activation, µCooling reduced humidity from 85% to ambient levels in under five minutes – a drop of 20% in relative humidity.

“Our MEMS-based architecture redefines what’s possible in headphone design,” said Yanchen Lu, VP of Systems Engineering at xMEMS Labs. “By combining Sycamore’s solid-state audio fidelity with µCooling’s advanced thermal and humidity management, we’re empowering manufacturers to move beyond conventional form factors – delivering thinner, lighter, and more expressive designs while maximizing sound quality and comfort. It’s a breakthrough that elevates both form and function, transforming the all-day listening experience.”

The debut of this next-generation headphone architecture highlights xMEMS’ continued innovation at the intersection of MEMS audio and micro-scale thermal management, extending the company’s leadership beyond earbuds and wearables into premium headphone categories.

Sycamore loudspeakers and µCooling devices are now available to select early access customers, with volume production targeted for the second half of 2026. Demonstrations will be available at xMEMS Live 2025 in Taipei (September 16) and Shenzhen (September 18).

Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management.

For more information about xMEMS and its solid-state solutions, visit xmems.com. For hi-res imagery, click here.

About xMEMS Labs, Inc.

Founded in 2018, xMEMS Labs is redefining sound and cooling with its breakthrough piezoMEMS platform. We created the world’s first solid-state MEMS speakers—powering AI glasses, earbuds, headphones, and smartwatches—and the first μCooling fan-on-a-chip, enabling improved thermal performance in smartphones, AI glasses, SSDs, and beyond.

xMEMS has over 250 granted patents worldwide for its technology. For more information, visit https://xmems.com.

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